Sponsorship

Three categories of sponsorship packages of the conference:

Diamond package

Registration and application fee - US$ 6,500 (HKD 50440)
-  Passes for 5 delegates
-  30min presentation session for introducing and promoting your company
-  1 page of colour advertisement in the Conference Proceedings*
-   An exhibit space to exhibit your products. (Including three A0 poster stands and one table)
*Additional amount of US$2,500 for inside front cover and US$2,000 for inside back cover

Gold package

Registration and application fee - US$ 4,000 (HKD 31000)
-  Passes for 3 delegates
-  20min presentation session for introducing and promoting your company
-  1 page of black and white advertisement in the Conference Proceedings
-  An exhibit space to exhibit your products. (Including two A0 poster stands and one table)

Silver package

Registration and application fee - US$ 2,000 (HKD 15520)
-  Passes for 1 delegates
-  10min presentation session for introducing and promoting your company
-  An exhibit space to exhibit your products. (Including One A0 poster stand and one table)



A0 poster stand


Table
(135cm x 60cm x 73cm)
(Length x Width x Height)

For application, please fill in the application form and fax it to (852) 2764 7657 or email it to contactus@aspen-aspe2017-topical.com



Payment

Online Credit Card Payment (HK dollar only)

Diamond package Gold package Silver package
US$ 6,500 (HKD 50440) [Payment] US$ 4,000 (HKD 31000) [Payment] US$ 2,000 (HKD 15520) [Payment]



Telegraphic Transfer (T/T)

Bank Name : Hang Seng Bank Limited
Bank Address : 83 Des Voeux Road Central, Hong Kong, P.R. China
Account Name : The Hong Kong Polytechnic University
Bank Account No. : 024-280-277476-668
SWIFT Code : HASE HKHH (optional)
Details of Payment : Please provide your name and write down "ASPEN/ASPE"

After the remittance, please send us a copy of the bank remittance receipt for follow-up action.



Cheque (US dollars/HK dollars)

Recipients: The Hong Kong Polytechnic University

Mailing address: GH040, State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong

Attention: ASPEN/ASPE Spring Topical Meeting 2017